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Select Technology:
Rigid
Flex
IMS
Rigid Flex
Cust Part Number:
Item Desc:
Upload File:
Delivery Format
Single
Array
Configure Panel
PCB Size X (mm)
PCB Size Y (mm)
PCB Qty X
PCB Qty Y
PCB Separation
Routing
V-CUT
V-Cut + Routing
Complicated V Cut
Jump V Cut
Routing + Jump V Cut
Routing with tabs
Routing with perforated tabs
V-Cut + Routing with Tabs
V-Cut + Routing with perforated tabs
No Separation
PCB Area (dm2)
Estimated Weight
kg
Panel Size X (mm)
Panel Size Y (mm)
Array Area (dm2)
Total Area
XOut
--
<=5
6 to 10
11 to 20
21 to 30
31 to 50
51 to 100
PCB Parameters
Panel JSON
Panel Image
Stackup JSON
Stackup Image
UOM
mm
Inch
VCUT Length :
Jump VCUT Places:
Big Panel Size:
--
Yes
No
Min Line:
Cu Layers:
PCB Thickness:
Final Cu Outer:
--
18 µm (0.5 oz)
35 µm (1 oz)
52 µm (1.5 oz)
70 µm (2 oz)
90 µm (2.5 oz)
105 µm (3 oz)
125 µm (3.5 oz)
140 µm (4 oz)
160 µm (4.5 oz)
175 µm (5 oz)
195 µm (5.5 oz)
210 µm (6 oz)
230 µm (6.5 oz)
245 µm (7 oz)
265 µm (7.5 oz)
280 µm (8 oz)
300 µm (8.5 oz)
315 µm (9 oz)
335 µm (9.5 oz)
350 µm (10 oz)
370 µm (10.5 oz)
385 µm (11 oz)
405 µm (11.5 oz)
420 µm (12 oz)
Final Cu Inner:
--
18 µm (0.5 oz)
35 µm (1 oz)
52 µm (1.5 oz)
70 µm (2 oz)
90 µm (2.5 oz)
105 µm (3 oz)
125 µm (3.5 oz)
140 µm (4 oz)
160 µm (4.5 oz)
175 µm (5 oz)
195 µm (5.5 oz)
210 µm (6 oz)
230 µm (6.5 oz)
245 µm (7 oz)
265 µm (7.5 oz)
280 µm (8 oz)
300 µm (8.5 oz)
315 µm (9 oz)
335 µm (9.5 oz)
350 µm (10 oz)
370 µm (10.5 oz)
385 µm (11 oz)
405 µm (11.5 oz)
420 µm (12 oz)
PTH Copper :
--
20 µm
18 to 25µm
<25 µm
>=25 µm
>=30 µm
35 µm
40 µm
Surface Finish:
--
HAL Lead Free
ENIG 1U
ENIG 2U
ENIG 3U
ENIG 4U
ENIG 5U
ENEPIG 3U(NiPdAu)
Immersion Tin
Immersion Silver
OSP
No Surface(Bare Cu)
Drill Quantity:
MultiPanel Gerber:
--
2
3
4
5
Separate Gerber:
--
2
3
4
5
Route Len / Panel
IPC Class:
--
IPC Class 2
IPC Class 3
Min Space:
Small BGA :
--
>= 200 µm
< 200 µm
Small IC :
Pth to Line inner :
Min Drill Size:
--
None
0.1
0.15
0.2
0.25
>=0.3
Press Fit:
--
Yes
No
Coil Track Board:
--
Yes
No
ROHs:
--
No
TOP Cu
BOT Cu
TOP Mask
BOT Mask
TOP Silk
BOT Silk
Base Material:
--
FR4-TG135
FR4-TG150
FR4-TG170
FR4-TG180
FR4 Halogen Free
Rogers-4003c
Rogers-4350B
Rogers-4835
PI
FR4+PI
Alu
FR4 Tg150 S100H(er 4,6@1GHz)
FR4 Tg170 S1000-2(er 4,4@1GHz)
FR4 Tg170 S1000-2M(er 4,6@1GHz)
S1141 (TG130)
S1151G (TG155, PLC0 CTI 600, Halogenfree)
S1600 (TG135, PLC0 CTI 600)
SH260 (TG 250, PI, Halogenfree)
Synamic6 (TG 185, Low-Dk)
FR4 Tg150 KB6165F(er 4,8-5,0@1MHz)
FR4 Tg170 KB6167F(er 4,6@1GHz)
KB6168 (TG 190, CTI 300)
KB6160/6160A/6160C (TG138)
FR4 Tg 170 IT-180(er 4,4@1GHz)
Bare Board :
--
Yes
No
Spl. Stackup Core :
--
1
2
3
4
5
Non Std Stackup PP:
--
2
4
6
8
Ducttape
@ViewBag.ducttape@
Cu Layers
FPC Thickness
Final Cu Outer
--
18 µm (0.5 oz)
35 µm (1 oz)
52 µm (1.5 oz)
70 µm (2 oz)
90 µm (2.5 oz)
105 µm (3 oz)
125 µm (3.5 oz)
140 µm (4 oz)
160 µm (4.5 oz)
175 µm (5 oz)
195 µm (5.5 oz)
210 µm (6 oz)
230 µm (6.5 oz)
245 µm (7 oz)
Final Cu Inner
--
35 µm (1 oz)
70 µm (2 oz)
105 µm (3 oz)
140 µm (4 oz)
175 µm (5 oz)
210 µm (6 oz)
245 µm (7 oz)
Min Space
Min Line/AR
Min Drill Size
--
None
0.1
0.15
0.2
0.25
>=0.3
Stackup:
--
Yes
No
Base Material PP:
--
TG 135 PP
TG 150 PP
TG 170 PP
TG 180 PP
Special TG 135 PP
Special TG 150 PP
Special TG 170 PP
Special TG 180 PP
Extra 1 PP
Extra 1 High TG PP
Solder Mask:
--
No
TOP
BOT
TOP+BOT
Mask Color:
--
No
Green
Blue
Red
Black
White
Bright White(LED)
Double Color
Special Color
Legend:
--
No
TOP
BOT
TOP+BOT
Double Color Legend
Mask Type:
--
Standard Gloss
Standard Matte
Semi-Matt
Taiyo Gloss
Taiyo Matte
Masking 2X:
--
Yes
No
Legend Color:
--
No
White
yellow
Black
Logo:
--
TOP Cu
BOT Cu
TOP Mask
BOT Mask
TOP Silk
BOT Silk
UL:
--
No
TOP Cu
BOT Cu
TOP Mask
BOT Mask
TOP Silk
BOT Silk
DateCode:
--
No
TOP Cu
BOT Cu
TOP Mask
BOT Mask
TOP Silk
BOT Silk
Leadfree:
--
Yes
No
E-test:
--
No
Yes
Yes + ET Stamp
Etest Fixture:
--
E-test Flying Probe
E-test Fixture
ET_Sign_E-test Fixture
ET_Sign_E-test Flying Probe
E-Test Points / panel:
LED Order:
Imped Ctrl:
--
No
Yes
Yes (Report + coupon)
Impedence Qty:
Micro Sec Report:
--
Yes
No
Destructive Report:
--
Yes
No
Solder Sample:
--
Yes
No
Blind/Buried Vias:
--
No
Blind
Buried
Blind+Buried
Edge Plating:
--
No
Yes
Special Via Filling:
--
IPC 4761 Type IIIb
IPC 4761 Type IVb
IPC 4761 Type V
IPC 4761 Type VII (filled&capped)
No
Via Filling:
--
Yes
No
Print Serial No:
--
Yes
No
QR Code :
Plated Slots:
--
No
Yes
Half PTH:
--
No
Yes
Half PTH Min:
Z Routing:
--
No
TOP
BOT
TOP+BOT
Countersunk:
--
No
TOP
BOT
TOP+BOT
Countersunk Qty:
Abnormal Hole:
--
Abnormal slot
stair slot
bell mouth hole
high-ratio hole
No Of Edges:
--
1
2
3
4
Via Caping:
--
Yes
No
Utilization Perc:
edge_connector:
--
No
GoldFinger Qty:
Kapton Tape:
--
TOP
BOT
TOP+BOT
No
Chamfer:
--
No
20
30
45
Counterbore:
--
No
TOP
BOT
TOP+BOT
Counterbore Qty:
Hard GoldFinger:
--
No
Yes
Au:5U"/Ni:120U"
Au:10U"/Ni:120U"
Au:15U"/Ni:120U"
Au:20U"/Ni:120U"
Au:25U"/Ni:120U"
Au:30U"/Ni:120U"
No Repair:
--
Yes
No
SMD pads on Top:
ALU Dielectric :
--
1W/mK
1.5W/mK
2W/mK
3W/mK
Coverlay:
--
No
TOP
BOT
TOP+BOT
Coverlay Color:
--
Yellow
Black
White
Stiffener :
--
No
TOP
BOT
TOP+BOT
Carbon Ink:
--
Yes
No
Peelable Mask:
--
No
TOP
BOT
TOP+BOT
Smd2Smd :
--
<=200 µm
201 to 249 µm
>=250 µm
Stacked/Staggered Via:
--
No
Yes
Stacked
Staggered
Via Inpad:
--
Yes
No
EMPB:
--
Yes
No
Min AR:
SMD pads on Bottom:
ALU Dielectric Thickness :
Paper Between PCB :
LPP Hardgold :
Backdrill PCB :
Remarks :
Stencil:
--
Top
Bot
Top+Bottom
Stencil Type:
Top
Bottom
Top+Bottom
Show Other Details
Buried Vias:
--
No
Yes
Control Dielectric:
--
Yes
No
Aspect Ratio:
--
<=8:1
>8:1
Taiyoink :
--
Yes
No
Low Matl Utilization:
--
Yes
No
Hole Density:
--
Rigid Flex:
--
Yes
No
Flex:
--
Yes
No
Total No Drill Holes:
Slides:
--
0
1
2
Tooling Standard:
Tooling Tech:
@ViewBag.tooling_tech@
Quantity
Currency
Delivery Schedule
Shipping Date
Discount %
Tooling Cost
Shipping Option:
Ätzwerk
Customer
Shipping Cost
Unit Cost
Margin %
Margin Amount
Unit Price (Incl. Shipping)
Cost to Customer
VAT %
VAT Amount
Price Incl. VAT
Calculate
Add to Cart
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Panel & Stackup Preview
Edit Panel
Configure Panel - Configure Panel out of single PCB
×
Single PCB:
mm → x
X
mm ↑ y
Manual
Arrangement:
×
Automatic according to panel size
~A5 150*200
~A4 210*300
Gap:
mm → x
mm ↑ y
Mechanic:
ALL V-CUT
ALL Routing
V-CUT
Routing
V-CUT
Routing
V-CUT
Routing
V-CUT
Routing
Routing with perforated Tabs
Routing without tabs
Frame:
10 mm
15 mm
mm ↑ y
mm → x
mm → x
mm ↑ y
V-CUT
Special:
No X-Out
Jump V-CUT
Special Tab requirement
CAM info:
V-CUT-Line count
mm / panel milling
Export Image
TL
TR
BL
BR
Shape:
Round
Square
Add
Size:
Mask:
Offset X:
Y:
Remove
Tool Size:
Mask:
Offset X:
Y:
Add
Remove
Same - Panel of same PCB
×
Design Count:
--
2
3
4
5
PCB per Panel:
Panel Dimension:
mm → x
X
mm ↑ y
Mechanical Processing:
V-CUT
Routing with Web/tabs
Web/tab with perforation
Special:
No X-Out
Jump V-Cut
Special Tab requirement
CAM info:
V-Cut-Line count
mm / panel routing
CAM-Panel
Customer-Panel
Mix - Panel of different PCBs
×
Design count:
--
2
3
4
5
PCB per Panel:
Panel size:
mm → x
X
mm ↑ y
Mechanic:
V-CUT
Routing with Web/tabs
Web/tab with perforation
Special:
No X-Out
Jump V-Cut
Special Tab requirement
CAM info:
V-Cut-Line count
mm / panel milling
CAM-Panel
Customer-Panel
Set of Mix - Panel of multiple identical Mix-Panel combined as a set
×
Design count:
--
2
3
4
5
Set count:
PCB per Panel:
Panel size:
mm → x
X
mm ↑ y
Mechanic:
V-Cut
Routing with Web/tabs
Routing with perforated Tabs
Special:
No X-Out
Jump V-Cut
Special Tab requirement
CAM info:
V-Cut-Line count
mm / panel routing
CAM-Panel
Customer-Panel
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Item Details
Parameters & Values
Delivery Format:
Carbon Ink:
Type:
PCB Size X(mm):
PCB Size Y(mm):
PCB Area(dm2):
PCB Qty X:
PCB Qty Y:
PCB Separation:
Array Size X(mm):
Array Size Y(mm):
Array Area(dm2):
VCUT Length :
Jump VCUT Places:
Big Panel Size:
Layers:
Min Space
IPC Class:
PCB Thickness:
Small BGA :
Rohs Marking:
Final Copper O/L:
Small IC :
Stackup:
Final Copper I/L:
Pth to Line Inner:
Base Material:
PTH Copper :
Min Drill Size:
Base Material PP:
Surface Finish:
Press-fit:
Bare Board:
Drill Quantity:
Coil Track Board:
Special Stackup Core:
Route Len / Panel:
X out:
Non Std Stackup PP:
Soldermask:
Mask Type:
Legend:
Mask Color:
Masking 2x:
Legend Color:
UL:
Print Serial No:
Min Line:
E-Test:
E-Test Points/panel:
No Repair :
Imped. Ctrl:
Slots:
Edge Plating:
Half PTH:
Half PTH Min:
DateCode:
Impedence Qty:
Z-routing:
Special Via Filling:
Countersunk:
Countersunk Qty:
Blind/Buried Vias:
Solder Sample:
Chamfer:
EMPB:
Hard GoldFinger:
GoldFinger Qty:
Peelable Mask:
Counterbore:
CounterBore Qty:
Min AR:
Smd2Smd:
Stacked/Staggered Via:
Via Inpad:
Seperate Gerber:
Multipanel Gerber:
Kapton Tape:
ALU Dielectric:
ALU Dielectric Thickness:
Coverlay:
Coverlay Color:
Stiffener :
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